Internal Stress Induced During Cure of Epoxy Regin
نویسندگان
چکیده
منابع مشابه
Viscoelastic Properties of an Epoxy Resin during Cure
The cure dependent relaxation modulus of an epoxy resin was investigated over the entire range of cure extent. Parallel plate rheometry was used to measure the material behavior below the gel point of the epoxy network. Creep testing in three-point bend was used for specimens cured past gelation. All data were converted to the stress relaxation modulus for comparison of the material behavior am...
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This research investigates the effect of post-cure time on residual stresses in laminated composites. Laminated composites were made of T300 carbon fibers and epoxy resin. The post-cure process was carried out at the constant temperature of 120 °C for 6 and 12 hours for two specimens. The slitting method was employed to determine through-thickness residual stress distribution of the composite l...
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In the electronics industry epoxy molding compounds, underfills and adhesives are used for the packaging of electronic components. These materials are applied in liquid form, cured at elevated temperatures and then cooled down to room temperature. During these processing steps residual stresses are built up resulting from both cure and thermal shrinkage. These residual stresses add up to the st...
متن کاملeffect of post-cure time on residual stress distribution in carbon/epoxy laminated composites
this research investigates the effect of the post-cure time on the residual stresses in laminated composites. laminated composites were made of t300 carbon fibers and epoxy resin. the post-cure process was carried out at the constant temperature of 120 °c for 6 and 12 hours for two specimens. the slitting method was employed to determine through-thickness residual stress distribution of the com...
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The cure process of epoxy prepreg used as composite pipe joints was studied by means of differential scanning calorimetry (DSC), Bohlin Rheometer and other techniques. Isothermal DSC measurements were conducted between 110 and 220 C, at 10 C intervals. The results show that the complete cure reaction could be achieved at 220 C. The isothermal cure process was simulated with the four-parameter a...
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ژورنال
عنوان ژورنال: Kobunshi Kagaku
سال: 1971
ISSN: 1884-8079,0023-2556
DOI: 10.1295/koron1944.28.884